SGIP announced the publication of a new white paper, The Evaluation of the Electromagnetic Phenomena Issues on Smart Grid Reliability, which addresses the performance of smart grid devices near power lines where electromagnetic (EM) phenomena could threaten grid reliability.
“Manufacturers of smart grid devices, along with EMC test labs, power utilities and more can benefit from this free resource,” said SGIP, an industry consortium representing a cross section of the energy ecosystem focusing on accelerating grid modernization and the energy Internet of Things through policy, education and promotion of interoperability and standards.
The white paper was developed by the Electromagnetic Interoperability Issues Working Group (EMIIWG), an SGIP committee.
“Readers will have a better understanding of the EM environment where smart grid devices operate, tests to determine the immunity of those devices to EM phenomena and sources of further information on testing,” the group said in an announcement.
“Electromagnetic environments and their impacts on smart grid devices is a complex issue but important to understand,” said SGIP Vice President Technology Aaron Smallwood.
The devices addressed by the white paper monitor and control power flow, and they send control information bi-directionally to perform smart grid functions.
“For a smart grid to endure electromagnetic phenomena, devices must not only survive events but also continue performing their intended functions,” said EMIIWG Chair Donald Heirman. “Our working group spent many months crafting this white paper to provide clear and credible direction for protecting our energy.”
