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Emerging Innovation

Next-Generation Microelectronics Manufacturing Aims to Sustain R&D Ecosystem

Homeland Security Today - July 28, 2023

Emerging Innovation

DARPA to Hold Proposers Day on HOTS Program to Develop High-Temperature Sensor Microelectronics

Homeland Security Today - May 5, 2023

DARPA Brings 2023 Electronics Resurgence Initiative Summit to Seattle

Homeland Security Today - May 5, 2023

Emerging Innovation

Department of Defense Celebrates Advancements in Microelectronics Packaging Capabilities

Homeland Security Today - April 7, 2023

Defense Production Act Title III Presidential Determination for Printed Circuit Boards and Advanced Packaging Production Capability

Homeland Security Today - March 28, 2023

Emerging Innovation

This Chilling Effect on Stacked Chips Could Ignite Computing at the Edge

Homeland Security Today - January 27, 2023

NSA Releases Series on Protecting DoD Microelectronics from Adversary Influence

Homeland Security Today - December 10, 2022

DARPA Seeks Proposals to Forge the Future of U.S. Microelectronics Manufacturing

Homeland Security Today - August 18, 2022

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